Circuit board structure for high density processing of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S780000, C361S799000, C361S777000, C361S790000, C361S818000, C174S250000, C174S260000

Reexamination Certificate

active

07495930

ABSTRACT:
A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two separate, grounded portions, with a first of the portions underlying the digital circuit and a second portion underlying the analog structure. In an exemplary embodiment, the circuit board has a high density of analog-to-digital converter integrated circuits, each with two analog input signals and ten parallel high speed digital output signals corresponding to each input signal. A grounded, conductive band is placed on the board between the inputs and outputs of the integrated circuit, and a ground plane is provide which has separate, interleaved analog and digital areas, with the digital area underlying only portions of the board having digital signals and structures and the analog area underlying only portions of the board having analog signals and structures.

REFERENCES:
patent: 5592391 (1997-01-01), Muyshondt et al.
patent: 5671220 (1997-09-01), Tonomura
patent: 5889314 (1999-03-01), Hirabayashi
patent: 6121827 (2000-09-01), Khoini-Poorfard et al.
patent: 2005/0092520 (2005-05-01), Chao et al.
patent: 2006/0012003 (2006-01-01), Mallikarjunaswamy et al.
patent: 2007/0291459 (2007-12-01), Hsu et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit board structure for high density processing of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board structure for high density processing of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board structure for high density processing of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4054615

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.