Circuit board structure embedded with semiconductor chips

Details Circuit board structure embedded with semiconductor chips Circuit board structure embedded with semiconductor chips

2011-01-04

2011-01-04

Doan, Theresa T (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S686000, C257S736000, C438S109000

Reexamination Certificate

active

07863729

ABSTRACT:
A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow conductive vias are formed in the dielectric layer for electrically connecting the circuit layer to the semiconductor chip. By providing the hollow conductive vias of present invention, the separating results of different coefficients of expansion and thermal stress are prevented, and thus electrical function of products is ensured.

REFERENCES:
patent: 6964887 (2005-11-01), Akagawa
patent: 7435910 (2008-10-01), Sakamoto et al.

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