Metal fusion bonding – Process – Plural joints
Patent
1985-06-28
1987-01-20
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228 36, 228 38, 228 40, 228 43, 118423, B23K 3102
Patent
active
046375414
ABSTRACT:
A process for soldering circuit boards comprising the steps of:
REFERENCES:
patent: 2671264 (1953-03-01), Pessel
patent: 2740193 (1953-07-01), Pessel
patent: 2770875 (1956-09-01), Zimmerman
patent: 2865093 (1957-05-01), Ingram
patent: 2872625 (1959-02-01), Liebscher
patent: 2884612 (1959-04-01), Bang
patent: 2964007 (1960-12-01), Buffington
patent: 3037274 (1962-06-01), Hancock
patent: 3039185 (1962-06-01), Oates
patent: 3041991 (1962-06-01), Dvorak
patent: 3053215 (1962-09-01), Guty
patent: 3092059 (1963-06-01), Tesch
patent: 3100471 (1963-08-01), Gutbier
patent: 3108560 (1963-10-01), Bowne
patent: 3112723 (1963-12-01), Potocki
patent: 3122117 (1964-02-01), Marzullo et al.
patent: 3135630 (1964-06-01), Bielinski et al.
patent: 3216643 (1965-11-01), DeVerter
patent: 3218193 (1965-11-01), Isaacson
patent: 3226821 (1966-01-01), Van Dijk et al.
patent: 3303983 (1967-02-01), Patrick
patent: 3386166 (1968-06-01), Tardoskegyi
patent: 3439854 (1969-04-01), Walker
patent: 3482755 (1969-12-01), Raciti
patent: 3532262 (1970-10-01), Laubmeyer et al.
patent: 3570741 (1971-03-01), Corsaro et al.
patent: 3588998 (1971-06-01), Corsaro
patent: 3604611 (1971-09-01), Lamberty
patent: 3680762 (1972-08-01), Kondo
patent: 3721379 (1973-03-01), Corsaro
patent: 3828419 (1974-08-01), Wanner
patent: 4009816 (1977-03-01), Feuchtbaum et al.
patent: 4090654 (1978-05-01), Volkert
patent: 4180199 (1979-12-01), O'Rourke et al.
patent: 4284225 (1981-08-01), Hess
patent: 4285457 (1981-08-01), Kondo
patent: 4311265 (1982-01-01), Kondo
patent: 4311266 (1982-01-01), Kondo
patent: 4363434 (1982-12-01), Flury
patent: 4401253 (1983-08-01), O'Rourke
patent: 4402448 (1983-09-01), O'Rourke
patent: 4410127 (1983-10-01), Bodewig
patent: 4424931 (1984-01-01), Lovrenich
patent: 4469716 (1984-09-01), Caratsch
patent: 4512508 (1985-04-01), Pachschwoll
patent: 4512510 (1985-04-01), Kondo
patent: 4530457 (1985-07-01), Down
Godici Nicholas P.
Heinrich Samuel M.
Unit Industries, Inc.
LandOfFree
Circuit board soldering device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit board soldering device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board soldering device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2130947