Circuit board singulation methods

Details Circuit board singulation methods Circuit board singulation methods

2005-05-03

2005-05-03

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S835000, C029S830000, C029S846000, C029S415000, C029S412000, C174S250000, C361S719000

Reexamination Certificate

active

06886247

ABSTRACT:
Methods to singulate circuit forming regions of a circuit board substrate assembly includes providing a plurality of circuit forming regions including at least one pair of adjacent circuit forming regions separated by at least one opening defined in substrate material between each pair of adjacent circuit forming regions. At least a portion of interconnection regions along singulation axes are removed to singulate the circuit forming regions.

REFERENCES:
patent: 3780431 (1973-12-01), Feeney
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4426773 (1984-01-01), Hargis
patent: 4532839 (1985-08-01), Easton
patent: 4621552 (1986-11-01), Lopez
patent: 4742615 (1988-05-01), Lopez
patent: 4791721 (1988-12-01), Anderson et al.
patent: 4926546 (1990-05-01), Polczynski et al.
patent: 5311407 (1994-05-01), Lumbard
patent: 5448451 (1995-09-01), Takubo et al.
patent: 5483857 (1996-01-01), Ziberna
patent: 5488886 (1996-02-01), Mohr
patent: 5521430 (1996-05-01), Shibata
patent: 5652185 (1997-07-01), Lee
patent: 5773764 (1998-06-01), von Vajna
patent: 5831218 (1998-11-01), Hu et al.
patent: 5854741 (1998-12-01), Shim et al.
patent: 5886398 (1999-03-01), Low et al.
patent: 5894648 (1999-04-01), Hill et al.
patent: 5960961 (1999-10-01), Gutentag
patent: 6047470 (2000-04-01), Drussel et al.
patent: 6114189 (2000-09-01), Chia et al.
patent: 6239380 (2001-05-01), Drussel et al.
patent: 6246015 (2001-06-01), Kim
patent: 6342727 (2002-01-01), Fujimori
patent: 6489218 (2002-12-01), Kim et al.
patent: 6664480 (2003-12-01), Drussel et al.
patent: 20020197826 (2002-12-01), Kim et al.

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