Circuit board reflow ovens

Details Circuit board reflow ovens Circuit board reflow ovens

1996-08-22

1998-08-25

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 62, 228 495, B23K 3704, B23K 37047

Patent

active

057975396

ABSTRACT:
An electronic circuit board solder reflow device for heating flux and transporting the circuit board from further treatment includes a conveyor for transporting the circuit board through a heating solder area to an output conveyor for further treatment. The reflow oven conveyor transports the circuit board through the solder reflow oven with an intermediate conveyor which bridges the gap between the reflow oven conveyor and the output conveyor.

REFERENCES:
patent: 4512508 (1985-04-01), Pachschwoll
patent: 4938410 (1990-07-01), Kondo
patent: 5259546 (1993-11-01), Volk

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