Circuit board ready to slot

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S250000, C174S262000, C361S777000, C361S783000, C361S760000

Reexamination Certificate

active

07919715

ABSTRACT:
A circuit substrate ready to slot is revealed, primarily comprising a board base with slot-reserved area. A plurality of bonding fingers, a plating bus loop, and a plurality of plating lines disposed on the bottom surface of the board base. The bonding fingers are located adjacent to but outside the slot-reserved area and the plating bus loop is located inside the slot-reserved area. The plating lines connect the bonding fingers to the plating bus lines. The plating bus loop includes two side bars closer to the long sides of the slot-reserved area than the bonding fingers to the long sides. Accordingly, the lengths of the plating lines within the slot-reserved area are shortened. It is possible to solve the issues of metal burs and shifting of the remaining plating lines when routing a slot along the peripheries of the slot-reserved area. Moreover, the plating current can evenly distribute to improve the plating qualities on the surfaces of the bonding fingers.

REFERENCES:
patent: 4967260 (1990-10-01), Butt
patent: 6130110 (2000-10-01), Hashimoto
patent: 6548764 (2003-04-01), Prindiville et al.
patent: 7098528 (2006-08-01), Vasishta et al.
patent: 2003/0111726 (2003-06-01), Khan et al.
patent: 2004/0219713 (2004-11-01), Lee
patent: 2007/0209830 (2007-09-01), Chu
patent: 2008/0042277 (2008-02-01), Lin
patent: 2008/0096312 (2008-04-01), Law et al.

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