Circuit board producing method and circuit board producing...

Details Circuit board producing method and circuit board producing... Circuit board producing method and circuit board producing...

2006-03-28

2006-03-28

Talbot, Brian K. (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S356000, C101S129000, C101S157000, C101S169000

Reexamination Certificate

active

07018672

ABSTRACT:
A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.

REFERENCES:
patent: 4893556 (1990-01-01), Hasegawa et al.
patent: 5761803 (1998-06-01), St. John et al.
patent: 6112656 (2000-09-01), Asai et al.
patent: 6139904 (2000-10-01), Yamasaki et al.
patent: 6237490 (2001-05-01), Takahashi et al.
patent: 6347583 (2002-02-01), Isogai et al.
patent: 6395335 (2002-05-01), Onishi et al.
patent: 6494133 (2002-12-01), Ooe
patent: 6553905 (2003-04-01), Miyahara et al.
patent: 60-126891 (1985-07-01), None
patent: 49293 (1991-03-01), None
patent: 4-247687 (1992-09-01), None
patent: 04-247687 (1992-09-01), None
patent: 5-16327 (1993-01-01), None
patent: 5-237986 (1993-09-01), None
patent: 06-234204 (1994-08-01), None
patent: 6-268345 (1994-09-01), None
patent: 268345 (1994-09-01), None
patent: 314799 (1997-12-01), None
patent: 11-145617 (1999-05-01), None
patent: 2000-071419 (2000-03-01), None
patent: 2000-188472 (2000-07-01), None
patent: 2000-299560 (2000-10-01), None
patent: 2000-309081 (2000-11-01), None
patent: 203437 (2001-07-01), None
M. Tachibana et al. “Resin Based Multi-Layered Circuit Board Alivh”, Surface Mount Technology. pp. 24-29, May 1996 (English abstract attached).
International Search Report corresponding to application No. PCT/JP01/10572 dated Feb. 26, 2002.
English translation of Form PCT/ISA/210.
European Search Report for EP 01 27 0088, dated Jul. 29, 2004.

Affiliated with

Also associated with

Rating

Circuit board producing method and circuit board producing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board producing method and circuit board producing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board producing method and circuit board producing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3527879