Circuit board, process for producing the same and a power...

Details Circuit board, process for producing the same and a power... Circuit board, process for producing the same and a power...

2006-03-07

2006-03-07

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

C216S013000, C029S847000

Reexamination Certificate

active

07008549

ABSTRACT:
Composite member2consisting of ceramic insulator substrate3and two metal layers4A and4B such as aluminum sheets is subjected to milling in order to remove the unwanted areas of metal layer4A (where inter-element spacings are to be formed). In order to suppress cracking due to substrate warpage, a small bottom portion of4A is left intact as residual metal layer4Aa which is preferably removed by etching. Milling is performed after thin-film layer of etching resist5is applied to the surface of metal layer4A. By milling in two stages, a step is formed at the bottom of lateral sides of a pattern element to make a skirt which contributes to reducing external stresses.

REFERENCES:
patent: 3756052 (1973-09-01), Quaal et al.
patent: 4325780 (1982-04-01), Schulz, Sr.
patent: 4548285 (1985-10-01), Sells et al.
patent: 4919232 (1990-04-01), Lofton
patent: 5602865 (1997-02-01), Laakmann
patent: 5666722 (1997-09-01), Tamm et al.
patent: 5688408 (1997-11-01), Tsuru et al.
patent: 6134117 (2000-10-01), Funk et al.
patent: 05031616 (1993-02-01), None

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