Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Patent
1995-05-16
1997-09-23
Lam, Cathy F.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
4283202, 428375, 428391, 428340, 428446, 428447, 428209, 428901, 174256, B32B 516, B32B 900, D02G 300, H05K 109
Patent
active
056702507
ABSTRACT:
This invention involves a prepreg composition and procedure for use in forming printed circuit boards with reduced and uniform dielectric constant, improved thermal expansion characteristics, and uniform appearance. The prepreg composite is a resin impregnated substrate and has a reduced dielectric constant as low as 3.5. It contains 5-30% by resin volume of hollow inorganic microsphere filler whose diameters are less than 40 micrometers, and the uniform distribution of the hollow inorganic microspheres is controlled by the presence of hydrophobic fumed silica or other similar flow modifier.
REFERENCES:
patent: 3700538 (1972-10-01), Kennedy
patent: 4134848 (1979-01-01), Adicoff et al.
patent: 4238641 (1980-12-01), Planting et al.
patent: 4241132 (1980-12-01), Pratt et al.
patent: 4268337 (1981-05-01), Ibata et al.
patent: 4309334 (1982-01-01), Valitsky
patent: 4335180 (1982-06-01), Traut et al.
patent: 4405543 (1983-09-01), Murphy et al.
patent: 4447565 (1984-05-01), Lula et al.
patent: 4610495 (1986-09-01), Landi
patent: 4640866 (1987-02-01), Suzuki
patent: 4657809 (1987-04-01), Eskind
patent: 4661301 (1987-04-01), Okada et al.
patent: 4680220 (1987-07-01), Johnson
patent: 4788230 (1988-11-01), Mudge
patent: 5126192 (1992-06-01), Chellis et al.
Principles of Electronic Packaging, pp. 340-345, Donald P. Seraphim, Ed., 1989.
Hawley's Condensed Chemical Dictionary, 11th Ed., p. 1001 and p. 965 (1987).
IBM Technical Disclosure Bulletin, vol. 31, No. 7, Dec. 1988 "Fabrication Of Printed Circuit Wiring Boards Using Insulation Layers With Low Dielectric Constant" by Chandrashekhar et al., pp. 25-56.
IBM Technical Disclosure Bulletin, vol. 22, No. 5, Oct. 1979 "Low Dielectric Constant Material For Printed Circuit Boards" by Haining et al.
Handbook of Fillers for Plastics, published by Van Nostrand Reinhold Company, New York, 1988, edited by Katz and Milewski, pp. 437-452.
IBM Corporate Specification, Flammability Test Methods, Materials and Components/Assemblies, May 1974.
IBM Internal Document "Characterization and Non-Destructive Testing of Thin Dielectrics" as cited in File Wrapper History of U.S. Pat. No. 5,126,192.
IPC Test Methods Manual (IPC-TMM-650) entitled: Glass Transition Temperature Dec. 1987.
IPC Test Methods Manual (IPC-TMM-650) entitled: Peel Strength, Flexible Printed Wiring Materials Jul. 1985.
IPC Test Methods Manual (IPC-TMM-650) entitled: Inner Layer Bond Strength of Multilayer Printed Circuit Boards Oct. 1987.
IPC Test Methods Manual (IPC-TMM-650) entitled: Coefficient of Linear Thermal Expansion of Electrical Insulating Materials Mar. 1986.
IPC Test Methods Manual (IPC-TMM-650) entitled: Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Chip Method Dec. 1987.
IPC Test Methods Manual (IPC-TMM-650) entitled: Dielectric Withstanding Voltage, Printed Wiring Material Dec. 1987.
IPC Test Methods Manual (IPC-TMM-650) entitled: Pressure Vessel Method for Glass Epoxy Laminate Integrity Jul. 1985.
Kernander Carl P.
Sanville, Jr. Robert J.
Lam Cathy F.
Polyclad Laminates, Inc.
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