Circuit board mounting for temperature stress reduction

Details Circuit board mounting for temperature stress reduction Circuit board mounting for temperature stress reduction

2005-10-06

2009-10-27

Kwok, Helen C. (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Angular rate using gyroscopic or coriolis effect

C073S493000

Reexamination Certificate

active

07607350

ABSTRACT:
A circuit board mounting system in one example comprises an improved mounting system for a circuit board disposed between housing elements, wherein the improvement comprises a plurality of slots formed in the circuit board and a plurality of bushings disposed within the slots, such that the housing elements rest on opposed ends of the bushings, and the circuit board moves in a plane substantially parallel to its mounting surfaces in response to changes in temperature, thus reducing thermal stress.

REFERENCES:
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patent: 5334897 (1994-08-01), Ineson et al.
patent: 5774328 (1998-06-01), Rector et al.
patent: 6274224 (2001-08-01), O'Bryan et al.
patent: 7181968 (2007-02-01), Still

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