Circuit board module and forming method thereof

Details Circuit board module and forming method thereof Circuit board module and forming method thereof

2006-06-26

2010-02-23

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S830000

Reexamination Certificate

active

07667143

ABSTRACT:
A circuit board module and a forming method thereof are provided. The circuit board module includes a first circuit board, a second circuit board and a conductive structure. The first circuit board has a first surface, a second surface and an opening. The opening passes through the first surface and the second surface. The first surface has a first solder pad. The second circuit board has a second solder pad. Part of the second circuit board passes through the opening from the first surface to the second surface, so that part of the second solder pad is exposed on the first surface. The conductive structure is electrically connected to the first solder pad and the second solder pad, so that the first circuit board is electrically connected to the second circuit board.

REFERENCES:
patent: 5321585 (1994-06-01), Trittschuh et al.
patent: 6538207 (2003-03-01), Barth
patent: 6833526 (2004-12-01), Sinkunas et al.
patent: 2004-247569 (2004-09-01), None
patent: 499826 (2002-08-01), None
patent: 544072 (2003-07-01), None
patent: 551784 (2003-09-01), None

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