Circuit board material and method of making

Details Circuit board material and method of making Circuit board material and method of making

1988-03-28

1989-12-19

Niebling, John F.

Electrical resistors

With base extending along resistance element

Resistance element coated on base

156151, 204 27, 204 447, 338308, H01C 1012, C25D 356

Patent

active

048885746

ABSTRACT:
An improved multilayered circuit board material and process for making that material is disclosed. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer, and a conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer comprises electroplated nickel-phosphorous containing up to about 30% by weight of phosphorous; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer is significantly increased. In addition, the electroplating bath does not contain chloride salts resulting in decreased pitting in the electrical resistance material layer.

REFERENCES:
patent: 2643221 (1953-06-01), Brenner et al.
patent: 3077442 (1963-02-01), Koretzky
patent: 3743583 (1973-07-01), Castonguay
patent: 3808576 (1974-04-01), Castonguay et al.
patent: 3857683 (1974-12-01), Castonguay et al.
patent: 4554219 (1985-11-01), Gamblin
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 389-400.
Max Hansen, Constitution of Binary Alloys, McGraw-Hill Book Co., New York, 1958, pp. 207-208.
Abner Brenner, Electrodeposition of Alloys, Volume II, Academic Press, New York, 1963, pp. 457-461.

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