Circuit board material

Electrical resistors – With base extending along resistance element – Resistance element coated on base

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338308, 428667, H01C 1012

Patent

active

048089672

ABSTRACT:
A multilayered circuit board material is disclosed. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer, and a conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer is formed from electroplated nickel-phosphorous containing up to about 30% by weight of phosphorous; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer is significantly increased. In addition, the electroplating bath does not contain chloride salts resulting in decreased pitting in the electrical resistance material layer.

REFERENCES:
patent: 2643221 (1953-06-01), Brenner et al.
patent: 3077442 (1963-02-01), Koretzky
patent: 3743583 (1973-07-01), Castonguay
patent: 3808576 (1974-04-01), Castonguay et al.
patent: 3857683 (1974-12-01), Castonguay
patent: 4554219 (1985-11-01), Gamblin
Abner Brenner, Electrodeposition of Alloys, vol. II, Academic Press, New York, 1963, pp. 457-461.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 389-400.
Max Hansen, Constitution of Binary Alloys, McGraw-Hill Book Co., New York, 1958, pp. 1027-1028.

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