Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-10-09
1999-03-23
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361751, 361774, 361783, 174255, 174257, 174264, 257698, 257700, 257737, 257781, 29846, 22818022, 438614, H01L 23485
Patent
active
058868771
ABSTRACT:
A circuit board, which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.
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Aoshima Katsuro
Shingai Noboru
Wada Tatsuo
Machine Active Contact Co., Ltd.
Meiko Electronics Co., Ltd.
Picard Leo P.
Vigushin John B.
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