Circuit board made from cross-linked polycyanurate polymer, ther

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4284228, 428252, 428287, 428901, 428902, B65D 8500

Patent

active

046235779

ABSTRACT:
The present invention is a circuit board having a substrate comprising a semi-IPN and at least one balanced polyaramid layer.

REFERENCES:
patent: 3737352 (1973-06-01), Avis et al.
patent: 3939024 (1976-02-01), Hoggatt
patent: 4157360 (1979-06-01), Prevorsek et al.
patent: 4444309 (1984-04-01), Morton
patent: 4446191 (1984-05-01), Miyadera et al.
patent: 4458412 (1984-07-01), Dean et al.
patent: 4489365 (1984-12-01), Daberkoe
patent: 4513055 (1985-04-01), Leibowitz
Ser. No. 463,798, by Palley et al.
Packard, Kevlar Epoxy Substrate for Interconnecting Leadless Chip Carrier, Sampe Journal, Jan./Feb. 1984.
G. Lubin, ed., Handbook of Composites, Shilbey, Filament Winding; pp. 449, 458-459, 467 (1982).
G. Lubin, ed., Handbook of Composites, Goldsworthy, Continuous Manufacturing Processes, pp. 479-481, 488-489 (1980).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit board made from cross-linked polycyanurate polymer, ther does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board made from cross-linked polycyanurate polymer, ther, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board made from cross-linked polycyanurate polymer, ther will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1617307

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.