Circuit board including multiple wire photosensitive adhesive

Details Circuit board including multiple wire photosensitive adhesive Circuit board including multiple wire photosensitive adhesive

1984-08-09

1985-10-01

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361406, 361414, H05K 103

Patent

active

045448019

ABSTRACT:
A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.

REFERENCES:
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patent: 3955024 (1976-05-01), Goldman et al.
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patent: 4030190 (1977-06-01), Varker
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patent: 4212960 (1980-07-01), Hayashi et al.
patent: 4287014 (1981-09-01), Gaku et al.
patent: 4309473 (1982-01-01), Minamisawa et al.
patent: 4388136 (1983-06-01), Huie
patent: 4395459 (1983-07-01), Herschdorfer et al.

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