Circuit board housing with molded in heat tab

Details Circuit board housing with molded in heat tab Circuit board housing with molded in heat tab

1997-03-18

1998-10-06

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361720, H02G 308, H05K 720

Patent

active

058179879

ABSTRACT:
The present invention provides a housing for an auxiliary circuit to be connected to a main circuit. The housing includes a heat tab for conducting the heat away from the auxiliary circuit components and an insulating case which is molded together with the heat tab to interlock the heat tab to the case. The case is molded around a chamfered edge of the heat tab. The insulating case includes a back and two sides extending from the back to define an area which contains the auxiliary circuit components. The heat tab is molded into the back and faces the component area so heat generated from the components can be spread to the main circuit by the heat tab. Openings may be provided through the back of the insulating case. The heat tab and legs on the sides of the housing are used to mount the power supply to a circuit board.

REFERENCES:
patent: 5041902 (1991-08-01), McShane
patent: 5050038 (1991-09-01), Malaurie et al.

Affiliated with

Also associated with

Rating

Circuit board housing with molded in heat tab does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board housing with molded in heat tab, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board housing with molded in heat tab will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-80569