Circuit board heatsink clamping assembly and technique

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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361388, H05K 720

Patent

active

044596391

ABSTRACT:
A technique and assembly is disclosed which allows more effective heat dissipation in a printed circuit assembly. A heatsink plate is etched using the artwork or masks used to form the conductive strips and terminals on a conventional printed circuit board. The heatsink plate is secured over at least a portion of the surface of the printed circuit board by an adhesive and the resulting heatsink assembly is mounted adjacent to a thermally conductive bracket. The heatsink assembly is then secured to the bracket by a wedge clamp which includes mating wedges configured to provide a high thermally conductive path between the heatsink plate and bracket for dissipating heat generated in or about the printed circuit heatsink assembly. The clamp configuration is such as to allow slidable movement between similarly shaped wedges which produces proper formation of the thermally conductive path during clamping.
The Government has rights to this invention pursuant to contract No. F04701-79-C-0083, awarded by the Department of the Air Force.

REFERENCES:
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patent: 3124640 (1964-03-01), Armstrong
patent: 3354542 (1967-11-01), Maillia
patent: 3509429 (1970-04-01), Graig et al.
patent: 3531579 (1970-09-01), Katz
patent: 3585455 (1971-06-01), Naylor
patent: 3758350 (1973-09-01), Weglin
patent: 4029999 (1977-06-01), Neumann et al.
patent: 4204248 (1980-06-01), Proffit et al.
patent: 4298904 (1981-11-01), Koenig

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