Circuit board heat dissipation layering arrangement

Details Circuit board heat dissipation layering arrangement Circuit board heat dissipation layering arrangement

1993-09-27

1994-12-20

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 361690, 361710, H05H 720

Patent

active

053750390

ABSTRACT:
A circuit board layering arrangement is capable of dissipating, into a heat sink, the heat produced by power components mounted on the circuit board, without permitting the short circuiting of electricity between the power components and other components or the heat sink. The arrangement comprises a circuit board, at least one power component and a heat sink. A plurality of through contacts are introduced into the circuit board, and a plurality of conductive tracks are disposed on first and second surfaces of the circuit board. The plurality of conductive tracks include two large-surface conductive tracks, one on each surface of the circuit board. One or more power components are surface-mounted on a first surface of the circuit board on a first large-surface conductive track. The second large-surface conductive track is thermally coupled to the first large-surface conductive track and to the heat sink. A layer of metal, preferably copper, may be disposed between the second large-surface conductive track and the heat sink, and a layer of glass cloth may be disposed between the second large-surface conductive track and the layer of metal.

REFERENCES:
patent: 4628407 (1986-12-01), August et al.
patent: 4941067 (1990-07-01), Craft
patent: 5172301 (1992-12-01), Schneider
Research Disclosure; "Applying Thermal Transfer Transfer Compound Under Quadpads"; No. 319, Nov. 1990.
IBM Technical Disclosure Bulletin; "Thermal Enhancement for a Pritned Wiring Board, Thermal Finger Pad"; vol. 33, No. 4, Sep. 1990.

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