Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-03-01
2005-03-01
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C029S832000, C361S321200
Reexamination Certificate
active
06860954
ABSTRACT:
A circuit board having coupled multilayered ceramic capacitors mounted thereon considerably reduces the generation of sounds developed by piezoelectric effects in the capacitors. A method for mounting the capacitors on the circuit board includes the step of forming lands for mounting the capacitors thereon at substantially plane-symmetrical positions on the front surface and the back surface of the circuit board, two lands at their substantially plane-symmetrical positions being connected each other. The capacitors, which are substantially identical each other, are then mounted on the lands of the front and the back surfaces such that the capacitors are disposed at substantially plane-symmetrical positions and electrically coupled to the lands. As a result, vibrations being transferred from the capacitors to the circuit board are cancelled out with each other and the resonance of the circuit board due to the vibrations from the capacitors is prevented, resulting in the generation of audible sounds with high sound pressure levels being considerably reduced compared to that of the prior art.
REFERENCES:
patent: 6336365 (2002-01-01), Blackadar et al.
Aftergut Jeff H.
Goff John L.
Katten Muchin Zavis & Rosenman
Taiyo Yuden Co. Ltd.
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