Circuit board having stepped vias

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174262, H05K 114

Patent

active

054060346

ABSTRACT:
A stepped via is formed in a circuit board. Large holes are punched in a predetermined pattern in two insulating sheets and small holes are punched in the same pattern in another insulating sheet. The holes are dimensioned so that their diameters are larger than the thicknesses of their respective sheets. However, the diameters of the larger holes are less than the combined thickness of all sheets. The sheets are juxtaposed so that the sheet with the smaller holes is between the other sheets and corresponding holes from the respective sheets are aligned. The sheets are pressed together to form an integral substrate. Metallization is applied from one side of the substrate, then metallization is applied to the substrate from the other side.

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