Circuit board having simultaneously and unitarily formed...

Details Circuit board having simultaneously and unitarily formed... Circuit board having simultaneously and unitarily formed...

2005-04-19

2005-04-19

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S825000, C029S831000, C228S254000, C257S690000, C257S668000, C257S739000, C257S737000, C257S701000, C361S720000

Reexamination Certificate

active

06880244

ABSTRACT:
Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including simultaneously and unitarily forming the wiring patterns and protrusions, and alternatively coupling electrically the protrusions with electrodes on a semiconductor chip component when present.

REFERENCES:
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patent: 5718367 (1998-02-01), Covell, II et al.
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patent: 5796590 (1998-08-01), Klein
patent: 5811317 (1998-09-01), Maheshwari et al.
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patent: 5874780 (1999-02-01), Murakami
patent: 5973405 (1999-10-01), Keukelaar et al.
patent: 6132543 (2000-10-01), Mohri et al.
patent: 6482676 (2002-11-01), Tsunoi et al.
patent: 0582052 (1994-02-01), None

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