Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-10-13
1996-12-17
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, 174255, 174259, 361808, H05K 720
Patent
active
055860079
ABSTRACT:
A circuit board consisting of an insulating substrate, a die bonding pad for fixedly bonding a semiconductor element onto the insulating substrate, and a wiring layer, in such a manner that the die bonding pad and wire layer are formed on the insulating substrate. A first heat conducting/radiating layer formed on the portion of the surface of the insulating substrate where the wiring layer and the die bonding pad are not formed, in such a manner that the first heat conducting/radiating layer is thermally connected to the die bonding pad. A second heat conducting/radiating layer is formed on the rear surface of the insulating substrate, and a heat bridge through which the die bonding pad or the first heat conducting/radiating layer is connected to the second heat conducting/radiating layer. The circuit board is light and small, and high in heat radiating characteristic, and low in manufacturing cost.
REFERENCES:
patent: 4941067 (1990-07-01), Craft
patent: 4945451 (1990-07-01), Gohl et al.
patent: 5019941 (1991-05-01), Craft
patent: 5050038 (1991-09-01), Malaurie et al.
patent: 5113315 (1992-05-01), Capp et al.
Fuji 'Xerox Co., Ltd.
Thompson Gregory D.
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