Circuit board having electrodes and pre-deposit solder receiver

Details Circuit board having electrodes and pre-deposit solder receiver Circuit board having electrodes and pre-deposit solder receiver

1995-08-29

1999-06-29

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 2281801, 228254, 361777, 361779, H05K 334, H05K 324, H01R 909

Patent

active

059171561

ABSTRACT:
Copper electrodes are formed on a circuit board to be bonded with leads of a TAB driving liquid crystal. A pre-deposit solder receiver having solder printed thereon is also provided on the circuit board in alignment with and prior to an electrode to be first bonded with a lead, to form a sufficient solder pool between plural electrodes and a bottom wall of a soldering iron. Solder/bonding is accordingly realized efficiently even from a starting electrode E1. Also, an excessive solder receiver may be provided in alignment with and after an electrode to be last bonded with a lead.

REFERENCES:
patent: 4339784 (1982-07-01), Shearer
patent: 4835345 (1989-05-01), Haarde
patent: 4891472 (1990-01-01), Vaurman et al.
patent: 5067042 (1991-11-01), Nagano
patent: 5227589 (1993-07-01), Weeks
patent: 5243143 (1993-09-01), Throop et al.
patent: 5453582 (1995-09-01), Amano et al.

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