Circuit board having electrically conductive structure...

Details Circuit board having electrically conductive structure... Circuit board having electrically conductive structure...

2007-08-07

2007-08-07

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000

Reexamination Certificate

active

10845276

ABSTRACT:
A circuit board and a fabrication method thereof. Providing the insulating layer with a first conductive layer formed thereon; wherein the insulating layer was formed on a core substrate with at least one patterned circuit layer thereon. A first resist layer is applied on a first conductive layer, forming first openings to expose the first conductive layer. A first patterned circuit layer, including conductive pads and traces, is formed in the first openings. A second resist layer is applied to cover the traces, and a conductive post is formed on each conductive pad. The first and second resist layers and the first conductive layer underneath the first resist layer are removed. A dielectric material layer is formed on the insulating layer with first patterned circuit layer, forming second openings to expose the conductive posts. A second conductive layer is formed on the dielectric material layer and in the second openings. A third resist layer is applied on the second conductive layer, forming third openings of the third resist layer to expose the second conductive layer. A second patterned circuit layer is formed in the second and third openings.

REFERENCES:
patent: 5118386 (1992-06-01), Kataoka et al.
patent: 6365843 (2002-04-01), Shirai et al.
patent: 6376052 (2002-04-01), Asai et al.
patent: 6717069 (2004-04-01), Yoneda
patent: 6828510 (2004-12-01), Asai et al.
patent: 2005/0121229 (2005-06-01), Takai et al.

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