Circuit board having an overlapping via

Details Circuit board having an overlapping via Circuit board having an overlapping via

2006-06-20

2006-06-20

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C174S266000

Reexamination Certificate

active

07064279

ABSTRACT:
A printed circuit board (100) includes a first BGA landing pad (102) having a first clearance zone (106) and a second BGA landing pad (104) having a second clearance zone (108). A via (110), overlaps the first clearance zone and the second clearance zone such that the first BGA landing pad and the second BGA landing pad are electrically coupled to the via.

REFERENCES:
patent: 5637835 (1997-06-01), Matern
patent: 5784262 (1998-07-01), Sherman
patent: 5875102 (1999-02-01), Barrow
patent: 6078013 (2000-06-01), Stack
patent: 6091155 (2000-07-01), Jonaidi
patent: 6168854 (2001-01-01), Gibbs
patent: 6346679 (2002-02-01), Nakamura
patent: 6509530 (2003-01-01), Pearson et al.
patent: 6700457 (2004-03-01), McCall et al.
patent: 6710433 (2004-03-01), Megahed et al.
patent: 6828513 (2004-12-01), Kistner
patent: 2003/0047348 (2003-03-01), Jessep et al.

Affiliated with

Also associated with

Rating

Circuit board having an overlapping via does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board having an overlapping via, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board having an overlapping via will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3633582