Circuit board having a window adapted to receive a single in-lin

Details Circuit board having a window adapted to receive a single in-lin Circuit board having a window adapted to receive a single in-lin

1997-02-26

1998-05-19

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361784, 439 65, H05K 111, H01R 909

Patent

active

057544115

ABSTRACT:
A mounting for a solderable component module (SCM.TM.) interconnect module includes an elongated trench or blind via for receiving an edge of the module. The module may be a circuit board or other electrical device and preferably includes edge finger connectors. The elongated trench preferably includes hemicylinders located about the periphery. The hemicylinders provide plated through conductors for connecting to the finger connectors of the module. The trench is made according to an advantageous method in which the aperture is etched in order to remove barbs or extra copper material caused by milling the aperture. Preferably, the module fits into the trench with an interference or size-on-size fit. The trench may include strain relief areas. Additionally, the mounting can include apertures for receiving legs on the mounted board.

REFERENCES:
patent: 3624587 (1971-11-01), Conrad
patent: 4336419 (1982-06-01), Wakayama et al.
patent: 5059557 (1991-10-01), Cragon et al.
patent: 5244395 (1993-09-01), DeSantis et al.
patent: 5455742 (1995-10-01), Phoy et al.
patent: 5484965 (1996-01-01), Woychik
patent: 5545924 (1996-08-01), Contolatis et al.
IBM Technical Disclosure Bulletin "Interconnectio System for Joephson Devices" by Rzant et al. vol. 20 No. 3, Aug. 1977.

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