Circuit board having a metal matrix composite inlay

Details Circuit board having a metal matrix composite inlay Circuit board having a metal matrix composite inlay

1995-03-30

1998-10-13

Kincaid, Kristine L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174260, H05K 100

Patent

active

058198580

ABSTRACT:
A circuit board includes a substrate of ceramic material and conductive strips in form of a metal layer which is cast onto the surface of the substrate and formed through locally stripping metal layer from the substrate surface. The circuit board further includes a recess for receiving an inlay of metal matrix composite material.

REFERENCES:
patent: 3710196 (1973-01-01), Fifield
patent: 3739614 (1973-06-01), Cranston
patent: 3770529 (1973-11-01), Anderson
patent: 4532152 (1985-07-01), Elarde
patent: 4806704 (1989-02-01), Belke, Jr. et al.
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5258887 (1993-11-01), Fortune
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5402004 (1995-03-01), Ozmat
patent: 5506755 (1996-04-01), Miyagi et al.
Patent Abstracts of Japan, vol. 11 No. 73 (-486), Mar. 5, 1987 & JP-A-61 230343 (Matsushita Electric Ind Co) Oct. 14, 1986.

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