Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1995-05-24
1996-08-13
Ryan, Patrick
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
22818021, 228 563, 228253, 174 521, B32B 900
Patent
active
055454658
ABSTRACT:
A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.
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D. S. Bendzel et al., "Circular Extrusion Stenciler" IBM Technical Disclosure Bulletin vol. 18, No. 10, Mar. 1976.
Gaynes Michael A.
Oxx George D.
Pierson Mark V.
Zalesinski Jerzy
Belk Michael E.
International Business Machines - Corporation
Lam Cathy K.
Ryan Patrick
LandOfFree
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