Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-10-30
2007-10-30
Nadav, Ori (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S690000, C257S734000, C257S738000, C257S780000, C257S793000
Reexamination Certificate
active
10756366
ABSTRACT:
It is an object of the invention to provide a circuit board for mounting a semiconductor chip and a manufacturing method thereof that prevent post-reflow warping and prevent peeling of the semiconductor chip and breakage resulting from thermal stress. In the circuit board for mounting a semiconductor chip, wiring regions, in which are formed wirings electrically connected to a semiconductor chip, are disposed on an insulating substrate in a vicinity of a chip region in which the semiconductor chip is mounted. A reinforcement layer, in which is formed reinforcement layers for reinforcing the insulating substrate, is disposed in a vicinity of the wiring regions.
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Nadav Ori
Oki Electric Industry Co. Ltd.
Rabin & Berdo PC
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