Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2011-05-10
2011-05-10
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S693000, C257S676000, C257S690000, C257SE33066
Reexamination Certificate
active
07939846
ABSTRACT:
An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.
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Chang Cheng-Yi
Chen Chin-Ching
Lin Ming-Kuei
Everlight Electronics Co., Ltd.
Hsu Winston
Margo Scott
Pham Long
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