Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate
2011-04-26
2011-04-26
Meier, Stephen D (Department: 2853)
Incremental printing of symbolic information
Ink jet
Ejector mechanism
Reexamination Certificate
active
07931354
ABSTRACT:
Second individual electrodes are formed and arranged in zigzag in two rows on one surface of a flexible sheet, and wirings connected to the second individual electrodes are arranged to pass between adjacent second individual electrodes of the other row. Formed on the other surface of the flexible sheet are electrode connection sections to be connected to the second individual electrodes through through-holes going through the flexible sheet. The electrode connection section has an area larger than the second individual electrode and is connected to an external electrode through solder.
REFERENCES:
patent: 2002/0031880 (2002-03-01), Chien et al.
patent: 2002/0079576 (2002-06-01), Seshan
patent: 2003/0030705 (2003-02-01), Koike et al.
patent: 2004/0053483 (2004-03-01), Nair et al.
patent: 2004/0060969 (2004-04-01), Imai et al.
patent: 2004/0130604 (2004-07-01), Watanabe et al.
patent: 2005/0179747 (2005-08-01), Iamai et al.
patent: 2005/0239233 (2005-10-01), Shinkai
patent: 2005/0279812 (2005-12-01), Tago et al.
patent: 2006/0226200 (2006-10-01), Banno et al.
patent: H0575253 (1993-03-01), None
patent: 3055146 (2000-04-01), None
patent: 3171219 (2001-03-01), None
patent: 2004114609 (2004-04-01), None
patent: 2004-319692 (2004-11-01), None
patent: 2005-161760 (2005-06-01), None
patent: 2005212238 (2005-08-01), None
Baker & Botts L.L.P.
Brother Kogyo Kabushiki Kaisha
Martinez, Jr. Carlos A
Meier Stephen D
LandOfFree
Circuit board for inkjet head does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit board for inkjet head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board for inkjet head will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2655627