Circuit board for high pin count surface mount pin grid arrays

Details Circuit board for high pin count surface mount pin grid arrays Circuit board for high pin count surface mount pin grid arrays

1994-02-02

1995-03-28

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

228254, 228215, B23K 3102, H05K 334

Patent

active

054009480

ABSTRACT:
A method for fabricating a printed circuit board for high pin count surface mount pin grid arrays is provided where surface mount pads for soldering a surface mount pin grid array package are isolated by solder mask layers. The printed circuit board is laminated with one or more solder mask layers containing apertures therein to expose the surface mount pad locations.

REFERENCES:
patent: 3700510 (1972-10-01), Keene et al.
patent: 4268585 (1981-05-01), Daur et al.
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4434434 (1984-02-01), Bhattacharya et al.
patent: 4661654 (1987-04-01), Strobel
patent: 4755631 (1988-07-01), Churchwell et al.
patent: 4806706 (1989-02-01), Machida et al.
patent: 4818728 (1989-04-01), Rai et al.

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