Circuit board for high pin count surface mount pin grid arrays

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174261, 174258, 361751, H05K 103

Patent

active

053130219

ABSTRACT:
A printed circuit board is provided with surface mount pads for soldering a surface mount pin grid array package. The printed circuit board is laminated with one or more solder mask layers containing apertures therein to expose the surface mount pad locations.

REFERENCES:
patent: 3700510 (1972-10-01), Keene et al.
patent: 4268585 (1981-05-01), Daur et al.
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4434434 (1984-02-01), Bhattacharya et al.
patent: 4661654 (1987-04-01), Strobel
patent: 4755631 (1988-07-01), Churchwell et al.
patent: 4806706 (1989-02-01), Machida et al.

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