Circuit board fabrication leading to increased capacity

Details Circuit board fabrication leading to increased capacity Circuit board fabrication leading to increased capacity

1983-07-13

1985-04-16

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

428901, 430 11, H05K 103

Patent

active

045117578

ABSTRACT:
Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

REFERENCES:
patent: 3934335 (1976-01-01), Nelson
patent: 4054479 (1977-10-01), Peiffer
patent: 4090936 (1978-05-01), Barton
patent: 4103102 (1978-07-01), Klein
patent: 4115185 (1978-09-01), Carlson et al.
patent: 4121007 (1978-10-01), Kobayashi et al.
patent: 4130424 (1978-12-01), Feit et al.
patent: 4169732 (1979-10-01), Shipley
patent: 4171974 (1979-10-01), Golda et al.
patent: 4299893 (1981-11-01), Pigeon et al.

Affiliated with

Also associated with

Rating

Circuit board fabrication leading to increased capacity does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board fabrication leading to increased capacity, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board fabrication leading to increased capacity will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1457843