Circuit board fabrication

Details Circuit board fabrication Circuit board fabrication

1990-09-28

1992-05-26

Tolin, Gerald P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

156902, 361410, 361414, 428901, 439 66, H05K 104

Patent

active

051170698

ABSTRACT:
A high density multi-level printed wiring board having inter-level electrical connections made by via interconnect holes which are drilled or punched through only those layers of the wiring board that separate the two layers containing the conductors which are to be connected and said holes being filled with a low-resistance silver-filled conductive epoxy.

REFERENCES:
patent: 4383363 (1983-03-01), Hayakawa
patent: 4650923 (1987-03-01), Nishigaki
patent: 4672152 (1987-06-01), Shinohara
patent: 4679122 (1987-07-01), Belke, Jr.
patent: 4685033 (1987-08-01), Inoue
patent: 4827083 (1989-05-01), Inasaka
patent: 4847146 (1989-07-01), Yeh
patent: 4851615 (1989-07-01), Butt
patent: 4967314 (1990-10-01), Higgins, III

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