Circuit board enclosure having heat transfer circuit board suppo

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361700, 361690, 361719, 361802, 165 803, 165185, 16510433, 174 35MS, H05K 720

Patent

active

058962727

ABSTRACT:
A circuit board enclosure for housing a plurality of circuit boards has a polymer casing having upper and lower openings and an interior. The circuit board enclosure also has upper and lower heat conductive pieces formed of a metal and fitting respectively within the upper and lower openings in the casing, in a water tight sealed relationship with the casing. The upper and lower heat conductive pieces have heat transfer fins protruding from the openings in the casing. The upper and lower heat conductive pieces have an interior side facing the interior of the enclosure. The interior sides have guide grooves to receive opposing sides of the circuit board. The guide grooves of the upper and lower heat conductive pieces are substantially parallel. The polymer casing may be formed of polycarbonate. The upper and lower heat conductive pieces may be formed of aluminum. The casing may have two upper and two lower holes, with each heat conductive piece having two sets of heat transfer fins fitting respectively through the two holes in the casing.

REFERENCES:
patent: 3631325 (1971-12-01), Wenz et al.
patent: 3909679 (1975-09-01), Petri
patent: 4506785 (1985-03-01), Seefeldt
patent: 5309315 (1994-05-01), Naedel et al.
patent: 5424913 (1995-06-01), Swindler

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