Circuit board, electronic circuit chip-mounted circuit board and

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174252, 174255, 361711, 361712, 361714, 361716, 361684, 361720, 361792, 361794, 361795, 361760, 361780, 434 68, 434485, H05K 720, H05K 111

Patent

active

053716531

ABSTRACT:
A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween, A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally, The circuit board can be formed to be compact, In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner, It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer, Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.

REFERENCES:
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 3568000 (1971-03-01), D'Aboville
patent: 4030190 (1977-06-01), Varker
patent: 4054483 (1977-10-01), Peiffer
patent: 4485429 (1984-11-01), Mittal
patent: 4535385 (1985-08-01), August et al.
patent: 4587594 (1986-05-01), McPherson
patent: 4628407 (1986-12-01), August et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4710854 (1987-12-01), Yamada et al.
patent: 4916260 (1990-04-01), Broaddus et al.
patent: 5136471 (1992-08-01), Inasaka
IBM Technical Disclosure Bulletin "Multi-Technology Chip Carrier" vol. 30 No. 2 Jul. 1987.
Computer Design "Innovative Package Emerge To Carry Faster, Denser Chips", A. DeSena, vol. 27, No. 18, 1st, Oct. 1988.
IBM Technical Disclosure Bulletin "Heat Dissipation from IC Chips Through Module Package" vol. 19 No. 11 Apr. 1977.
IBM Technical Disclosure Bulletin "Control of Thermal Coefficient Of Expansion Of Substrate Materials" vol. 19 No. 8 Jan. 1977.
IBM Technical Disclosure Bulletin "Multichip Packaging" vol. 14 No. 10 Mar. 1972.
IBM Technical Disclosure Bulletin vol. 19, No. 11 Apr. 1977 D. Balderes, J. R. Lynch, and R. A. Yacavonis.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit board, electronic circuit chip-mounted circuit board and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board, electronic circuit chip-mounted circuit board and, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board, electronic circuit chip-mounted circuit board and will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-218923

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.