Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2000-02-29
2001-11-20
Sircus, Brian (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S801000
Reexamination Certificate
active
06319018
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to electrical and physical connections of circuit boards.
2. Description of the Relevant Art
Often a single electronic device will include multiple circuit boards. Each circuit board is firmly attached within a housing of the electronic device. Further, each circuit board is electrically connected to a common ground voltage, and usually to a common power supply voltage, such as 5 volts. In order to establish the common ground voltage and common supply voltage for the multiple circuit boards, it is common to provide a grounding bar and a power supply bar.
FIGS. 1 and 2
illustrate an electrical assembly in accordance with the background art, such as a network interface device (NID), as commonly employed in the telecommunications art. In
FIGS. 1 and 2
, an electrical box of the NID includes a base
1
and a cover
2
. The cover
2
is attached to the base
1
by a hinge
3
.
FIG. 1
is a top view, illustrating the NID with its cover
2
open, providing access to the contents of the base
1
.
FIG. 2
is a cross sectional view illustrating the NID with its cover
2
closed.
Inside the base
1
, a grounding bar
4
is connected to a floor of the base
1
, via first screws
5
. A power supply bar
6
is connected to the floor of the base
1
, via second screws
7
. Electrical conductivity does not exist between the grounding bar
4
and power supply bar
6
. A plurality of first threaded studs
8
extend away from an upper surface of the grounding bar
4
. Likewise, a plurality of second threaded studs
9
extend away from an upper surface of the power supply bar
6
.
A plurality of circuit boards
10
, such as printed circuit boards, are attached between the grounding bar
4
and the power supply bar
6
. Each circuit board
10
includes a first through hole
11
surrounded by a first electrically conductive ring
12
and a second through hole
13
surrounded by a second electrically conductive ring
14
. One of the first threaded studs
8
is passed through the first through hole
11
, and one of the second threaded studs
9
is passed through one of the second through holes
13
. A first washer
15
and first nut
16
are applied to the first threaded stud
8
. Likewise, a second washer
17
and second nut
22
are applied to the second threaded stud
9
.
As illustrated in
FIG. 1
, a first wire
18
is passed through a first port
19
formed by the base
1
and cover
2
. The first wire
18
is electrically connected to the grounding bar
4
, via one of the first screws
5
, or one of the first nuts
16
. The first wire
18
provides the common grounding voltage. A second wire
20
is passed through a second port
21
formed by the base
1
and cover
2
. The second wire
20
is electrically connected to the power supply bar
6
, via one of the second screws
7
, or one of the second nuts
22
. The second wire
20
provides the common power supply voltage.
By the arrangement of
FIGS. 1 and 2
, each printed circuit board
10
is firmly connected to the base
1
. Also, a common ground voltage and a common power supply voltage are provided to the first electrically conductive ring
12
and the second electrically conductive ring
14
of each printed circuit board
10
, respectively.
The arrangement of
FIGS. 1 and 2
suffers drawbacks. The grounding bar
4
and power supply bar
6
are bulky and rather expensive. Therefore, the overall size of the NID be enlarged to accommodate the grounding bar
4
and the power supply bar
6
. Further, the overall cost of manufacturing the NID must be increased by the material costs of the grounding bar
4
and the power supply bar
6
, as well as, by the labor costs associated with installing the grounding bar
4
and the power supply bar
6
.
SUMMARY OF THE INVENTION
It is an object of the present invention to overcome one or more of the drawbacks associated with the background art.
It is a further object of the present invention to provide a system and method of grounding and/or powering multiple circuit boards which is less expensive and/or less labor intensive.
It is an additional object of the present invention to provide a system and method of grounding and/or powering multiple circuit boards which consumes less space within an enclosure, housing the circuit boards.
These and other objects are accomplished by providing an electrical assembly comprising a base; a first circuit board disposed on said base; a first electrically conductive portion associated with said first circuit board; a second circuit board disposed on said base; a second electrically conductive portion associated with said second circuit board; a first fastener located between said first circuit board and said second circuit board and attaching said first circuit board to said second circuit board; and a third electrically conductive portion associated with said first fastener electrically connecting said first conductive portion to said second conductive portion.
Further, these and other objects are accomplished by providing an electrical assembly comprising: a circuit board having a first surface, a first edge and a second edge; a first electrically conductive portion formed on said first surface; a first cutout formed along said first edge adjacent said first electrically conductive portion; and a second cutout formed along said second edge adjacent said first electrically conductive portion.
Moreover, these and other objects are accomplished by a method of forming an electrical assembly comprising the steps of: providing a base, a first circuit board with a first electrically conductive portion, a second circuit board with a second electrically conductive portion, and a first fastener with a third electrically conductive portion; disposing the first and second circuit boards on the base, inserting the first fastener between the first and second circuit boards; and contacting the third electrically conductive portion with the first and second electrically conductive portions to establish a common circuit.
Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
REFERENCES:
patent: 2980878 (1961-04-01), Swengel
patent: 4577918 (1986-03-01), Kasdagly
patent: 5018192 (1991-05-01), Smith
patent: 5355282 (1994-10-01), Yokemura et al.
Avaya Technology Corp.
Birch & Stewart Kolasch & Birch, LLP
Le Thanh-Tam
Sircus Brian
LandOfFree
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