Circuit board construction

Details Circuit board construction Circuit board construction

1989-11-01

1990-10-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Miscellaneous

174261, 361410, H05K 104

Patent

active

049673149

ABSTRACT:
A high density multi-level printed wiring board having inter-level electrical connections made by via interconnect holes which are drilled or punched through only those layers of the wiring board that separate the two layers containing the conductors which are to be connected and said holes being filled with a low-resistance silver-filled conductive epoxy.

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patent: 4328531 (1982-05-01), Nagashima
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4501787 (1985-02-01), Marchetti et al.
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4538143 (1985-08-01), Ito
patent: 4663497 (1987-05-01), Reimann
patent: 4679122 (1987-07-01), Belke et al.
patent: 4784068 (1988-05-01), Fahner et al.
patent: 4827083 (1989-05-01), Inasaka
L. D. Green, Printed Circuit Packaging, IBM Tech. Disc. Bull., V. #3, #12, May 1961, p. 5.
T. D. Zucconi, Z Direction Pads, IBM Tech. Disc. Bull., V. 21 #2, Jul. 1978, pp. 501 and 502.
Andrew Lovinger, Development of Electrical Conduction in Silver-filled Epoxy Adhesives, J. Adhesion, V. 10, pp. 1-15, (1979) Scotland copy in 252-512.

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