Circuit board construction

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428209, 428432, 428901, 361383, 29840, 174 16HJ, B32B 300, H02B 100, H01B 734, H05K 334

Patent

active

047118040

ABSTRACT:
A circuit board assembly for supporting a leadless ceramic chip carrier for surface mounting on a printed circuit board and for reducing the thermally induced stress on solder joint connections at the carrier-to-board contacts. The board includes an inner heat sink core comprising a highly conductive plate having openings provided therein in the areas which underlie the chip carrier. The openings have inserts therein of a material which closely matches the thermal coefficient of expansion of the ceramic to thereby reduce stress of the intermediate solder joints.

REFERENCES:
patent: 4318954 (1982-03-01), Jensen
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4546406 (1985-10-01), Spinelli et al.
patent: 4570337 (1986-02-01), Butt
patent: 4581680 (1986-04-01), Garner
patent: 4590095 (1986-05-01), Park
IBM Tech. Disclosure Bulletin, T. O. Ledgwick, Mounting Technique for Solder Reflow Areal Array Mounted Silicon Chips which Allows Direct & Efficient Backside Heat Removal, vol. 20, No. 12, May, 1978, p. 5391.

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