Circuit board capable of efficiently conducting heat through an

Details Circuit board capable of efficiently conducting heat through an Circuit board capable of efficiently conducting heat through an

1994-08-17

1996-12-31

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 174255, 361711, 361712, 361714, 361716, 361720, 361792, 361795, 361760, 361780, 361721, H05K 720, H05K 111

Patent

active

055900305

ABSTRACT:
A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween. A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally. The circuit board can be formed to be compact. In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner. It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer. Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.

REFERENCES:
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 3568000 (1971-03-01), D'Akoville
patent: 4030190 (1977-06-01), Varker
patent: 4054483 (1977-10-01), Peiffer
patent: 4485429 (1984-11-01), Mittal
patent: 4498122 (1985-02-01), Rainal
patent: 4535385 (1985-08-01), August et al.
patent: 4587594 (1986-05-01), McPherson
patent: 4628407 (1986-12-01), August et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4710854 (1987-12-01), Yamada et al.
patent: 4809058 (1989-02-01), Funamoto et al.
patent: 4916260 (1990-04-01), Broaddus et al.
patent: 4954929 (1990-09-01), Baran
patent: 5136471 (1992-08-01), Inasaka
patent: 5371653 (1994-12-01), Kametani et al.
IBM Technical Disclosure Bulletin vol. 19, No. 11 Apr. 1977 D. Balderes, J. R. Lynch, and R. A. Yaclavonis.
IBM Technical Disclosure Bulletin "Heat Dissipation from IC Chips Through Module Package" vol. 19 No. 11 Apr. 1977.
IBM Technical Disclosure Bulletin "Control of Thermal Coefficient of Expansion of Substrate Materials" vol. 19 No. 8 Jan. 1977.
IBM Technical Disclosure Bulletin "Multichip Packaging" vol. 14 No. 10 Mar. 1972.
IBM Technical Disclosure Bulletin "Multi-Technology Chip Carrier" vol. 30 No. 2 Jul. 1987.
Computer Design "Innovative Package Emerge To Carry Faster, Denser Chips", A. DeSena, vol. 27, No. 18, 1st, Oct. 1988.

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