Circuit board assembly with foam substrate and method of making

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

4284228, 4283084, 428344, 428334, 4283044, 4283173, 4284251, 428901, 174256, B32B 300, B32B 2700, B32B 514, B32B 712

Patent

active

057336393

ABSTRACT:
A laminated circuit board comprising a high frequency, low dielectric, and low dissipation factor foam substrate layer and at least one metal cladding layer laminated to the foam substrate layer. The foam substrate layer is formed of a closed-cell polyisocyanurate rigid foam having a closed-cell structure greater than 95%.

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