Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-01-30
2007-01-30
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23086, C257SE23084, C257SE23090, C257S719000, C257S720000, C257S712000, C257S071000, C257S726000, C257S727000, C257S706000, C257S707000, C257S710000, C361S760000, C361S785000, C361S719000, C165S185000, C165S080300, C439S264000, C439S068000, C439S073000
Reexamination Certificate
active
11049474
ABSTRACT:
An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is removably secured to the first side of the circuit board at the mounting holes.
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Berto Thomas E.
Vaze Anirudh N.
Agilent Technologie,s Inc.
Williams Alexander Oscar
LandOfFree
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