Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-05-14
2000-06-20
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361803, 361767, 361765, 257773, 257690, 257737, 257738, 174255, 174260, 174 521, 22818021, 22818022, 439 68, H05K 118
Patent
active
060785055
ABSTRACT:
A method is disclosed for attaching a device package to a circuit board with a chip mount area that has a set of elongated pads located near the perimeter of a chip mount area. In accordance with this method, a mask is formed on the circuit board. A plurality of openings are formed in the mask, including a plurality of openings over at least one of the pads. A plurality of adhesive masses area attached to a surface of the device package, each adhesive mass being aligned with an electrical contact area on the surface of the device package. The device package is positioned over the circuit board to align the adhesive masses with the openings in the mask, and the device package is attached to the circuit board. In one embodiment, the mask openings are formed in a staggered formation. An advantage of this method is that a less expensive chip of the ball grid array type may be used on a circuit board design for gull-wing-leaded chip packages without a substantial redesign of the circuit board. The invention also allows ball grid array-type packages and gull-wing leaded chip packages to be used interchangeably for the same circuit board design with only a modification of the mask used in the circuit board fabrication process.
REFERENCES:
patent: 5471090 (1995-11-01), Deutsch et al.
patent: 5663594 (1997-09-01), Kimura
patent: 5859474 (1999-01-01), Dordi
patent: 5895554 (1999-04-01), Gordon
patent: 5917149 (1999-06-01), Barcley et al.
patent: 5951304 (1999-09-01), Wildes et al.
Foster David
Picard Leo P.
Triquint Semiconductor, Inc.
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