Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-04-18
2008-08-19
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S702000, C361S703000, C361S704000, C361S719000, C165S080400, C165S104330, C165S908000
Reexamination Certificate
active
07414845
ABSTRACT:
A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, thereby improving the heat transfer from heat-generating components on the circuit board. For a computer, a plurality of heat-generating components are mounted on the motherboard, including a plurality of processors, a plurality of memory cards, a plurality of graphics cards, and a plurality of power supplies. A pump for the cooling liquid can also be mounted on the motherboard.
REFERENCES:
patent: 2440930 (1948-05-01), Camilli et al.
patent: 3812402 (1974-05-01), Garth
patent: 4302793 (1981-11-01), Rohner
patent: 4590538 (1986-05-01), Cray, Jr.
patent: 4765397 (1988-08-01), Chrysler et al.
patent: 5021924 (1991-06-01), Kieda et al.
patent: 5107397 (1992-04-01), Azar
patent: 5131233 (1992-07-01), Cray et al.
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5448108 (1995-09-01), Quon et al.
patent: 5731954 (1998-03-01), Cheon
patent: 5796583 (1998-08-01), Gale et al.
patent: 5943211 (1999-08-01), Havey et al.
patent: 6019167 (2000-02-01), Bishop et al.
patent: 6052284 (2000-04-01), Suga et al.
patent: 6234240 (2001-05-01), Cheon
patent: 6262890 (2001-07-01), Dhawan et al.
patent: 6313990 (2001-11-01), Cheon
patent: 6333849 (2001-12-01), Donahoe et al.
patent: 6450832 (2002-09-01), Aguilar et al.
patent: 6664627 (2003-12-01), Cheon
patent: 6938678 (2005-09-01), Bortolini et al.
patent: 6979772 (2005-12-01), Meng-Cheng et al.
patent: 7054165 (2006-05-01), Yi-Lung
patent: 7233501 (2007-06-01), Ingalz
patent: 7295436 (2007-11-01), Cheon
patent: 2003/0081380 (2003-05-01), Nakagawa et al.
patent: 2006/0012959 (2006-01-01), Lee et al.
patent: 2006/0037739 (2006-02-01), Utsunomiya
patent: 2007/0025081 (2007-02-01), Berlin et al.
patent: 2007/0034360 (2007-02-01), Hall
patent: 2007/0227710 (2007-10-01), Belady et al.
patent: 2004-84958 (2004-03-01), None
Article printed from http://www.tomhardware.com/2006/01/09/strip—out—the—fans/, Strip Out the Fans, Add 8 Gallons of Cooking Oil.
Article printed from http://pugetsystems.com/submerged.php, “Mineral Oil Submerged Computer”.
Anderson et al, Subcooled Flow Boiling Scheme for Direct Immersion Cooling or Three-Dimensional Electronic Packages in Large-Scale Computers or Supercomputers, IBM Technical Disclosure, No. 11, Apr. 1991, pp. 387-390.
Feurstein et al, Immersion Forced Cooling of High-Powered Chips, IBM Technical Discloure Bulletin, Jan. 1985, pp. 4805-4806.
“Koolance Superior Liquid Cooling Systems”, PSU-1200ATX-12S User Manual, English v1.01, pp. 1-10.
Images printed from http://www.koolance.com/shop/images/more/psu-1200atx-12s, Apr. 3, 2007, pp. 1-3.
Diagrams printed from http://www.koolance.com/shop/diagrams/more/psu-1200atx-12s, Apr. 3, 2007, pp. 1-4.
“Koolance 1200W Liquid-Cooled Power Supply”, article printed from http://www.koolance.com/shop/product—info.php?cPath=28—73&products—id=387, Apr. 3, 2007, pp. 1-3.
http://www.tomshardware.com, “Tom's Hardware—Computer Hardware News, Tests, Ratings and Reviews”, Aug. 21, 2007, pp. 1-2.
Article printed from http://www.tomshardware.com/2006/01/09/strip—out—the—fans/, “Strip Out The Fans, Add 8 Gallons of Cooking Oil / Tom's Hardware”, Aug. 1, 2007, pp. 1-30.
http://www.pugetsystems.com/ “Puget Custom Computer—Desktop Computers, Laptops, Servers”, Aug. 21, 2007, 1 page.
Article printed from http://www.pugetsystems.com/submerged.php, “Mineral Oil Submerged Computer”, Aug. 1, 2007, pp. 1-7.
Specification for co-pending U.S. Appl. No. 11/736,947, filed Apr. 18, 2007.
Specification for co-pending U.S. Appl. No. 11/736,965, filed Apr. 18, 2007.
International Search Report of International Application No. PCT/US2007/068864.
Written Opinion of the International Searching Authority of International Application No. PCT/US2007/068864.
Attlesey Chad Daniel
Berning Allen James
Klum R. Daren
Gandhi Jayprakash N
Hamre Schumann Mueller & Larson P.C.
Hardcore Computer, Inc.
Hoffberg Robert J
LandOfFree
Circuit board assembly for a liquid submersion cooled... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit board assembly for a liquid submersion cooled..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board assembly for a liquid submersion cooled... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4011493