Circuit board assembly and backlight module comprising the same

Illumination – Light source and modifier – With ventilating – cooling or heat insulating means

Reexamination Certificate

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Details

C362S373000, C361S719000, C361S720000, C257S706000

Reexamination Certificate

active

07922362

ABSTRACT:
A circuit board assembly and a backlight module comprising the circuit board assembly are provided. The circuit board assembly has a first surface and a second surface opposite to the first surface, and further comprises at least one laminate, a first conductive wiring structure and a coating. The first conductive wiring structure is formed on the first surface. The coating is formed on the coating area of the second surface, wherein the coating can conduct heat and provide electric insulation. Thus, the circuit board assembly is adapted to outwardly conduct heat from the laminate through the second surface and to promote the heat dissipation efficiency of the circuit board assembly.

REFERENCES:
patent: 4299873 (1981-11-01), Ohihara et al.
patent: 5920458 (1999-07-01), Azar
patent: 2005/0024834 (2005-02-01), Newby
patent: 2007/0201247 (2007-08-01), Ohno et al.
patent: 1830085 (2006-09-01), None
patent: 1837926 (2006-09-01), None
patent: 1941346 (2007-04-01), None
patent: I246370 (1993-01-01), None
patent: 00453629 (2001-09-01), None
patent: 200524515 (2005-07-01), None
patent: I255691 (2006-05-01), None
patent: 96106301 (2007-02-01), None
English language translation of abstract of TW I246370.
English language translation of abstract of TW 96106301.
English language translation of abstract of TW 00453629.
Chinese language office action dated Sep. 25, 2009.
English language translation of abstract and pertinent parts of CN 1837926 (published Sep. 27, 2006).
English language translation of abstract and pertinent parts of CN 1830085 (published Sep. 9, 2006).
English language translation of abstract and pertinent parts of CN 1941346 (published Apr. 4, 2007).
Taiwanese language office action dated Jun. 18, 2010.
English language translation of abstract and pertinent parts of TW 200524515 (published Jul. 16, 2005).
English language translation of abstract and pertinent parts of TW I255691 (published May 21, 2006).

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