Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate
2007-02-06
2007-02-06
Abrams, Neil (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
C439S620270
Reexamination Certificate
active
10800677
ABSTRACT:
A first board, on which electric wires are wired, includes a first part having a first thickness and a second part continued from the first part and having a second thickness smaller than the first thickness. A second board, on which bus bars are arranged, is disposed on the second part of the first board. The second board has a third thickness which is determined such that an additional thickness of the second thickness and the third thickness is not greater than the first thickness.
REFERENCES:
patent: 6514091 (2003-02-01), Saito et al.
patent: 6846183 (2005-01-01), Kato et al.
patent: 9-140028 (1997-05-01), None
Abrams Neil
Yazaki -Corporation
LandOfFree
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