Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-09-15
2000-09-26
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361767, 361777, 257 99, 257737, 257738, 257778, 257779, 257780, 174257, 174260, 174261, 29834, 29840, 22818021, 22818022, 438108, 438975, H01L 23498
Patent
active
061250430
ABSTRACT:
The circuit board (1) has a component (101) mounted on it by means of a soldering process which causes an automatic, passive alignment of the component (101) due to the surface tension in a melted piece of solder which electrically connects two pads (2, 102), one (102) of which is on the component and the other (2) of which is on the circuit board. Stand-offs (20) are used to provide a suitable spacing or distance between the component (101) and the circuit board (1). The other pad (2) has a surface that is divided into a central part (3) and an edge part (4), both wettable by the solder. The second or edge part (4) is shaped like a ring and surrounds the central part and is composed so that it is more slowly wettable by the solder than the central part. The spacing established by the stand-offs is dimensioned so that a melted piece of the solder between the pads produces a force drawing the component (101) toward the circuit board (1) because of surface tension in the melted solder.
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"Stand-Offd for Chip Alignment as well as Controlled Collapse in Chip Joining", by A.F. Galloway, K.R. Grebe and C.Y. Ting, IBM Technical Disclosure Bulletin, vol. 23, No. 5, Oct. 1980, pp. 2156-2158.
"Chip Mounting with Orestretched Joints", by V.D. Coombs, IBM Technical Disclosure Bulletin, vol. 16, No. 3, Aug. 1973, p. 767.
Hauer Heiner
Kuke Albrecht
Moess Eberhard
Scholz Werner
Picard Leo P.
Robert & Bosch GmbH
Striker Michael J.
Vigushin John B.
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