Circuit board apparatus and method for spray-cooling a circuit b

Details Circuit board apparatus and method for spray-cooling a circuit b Circuit board apparatus and method for spray-cooling a circuit b

1996-06-28

1998-06-02

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 257714, 174 151, H05K 720

Patent

active

057610355

ABSTRACT:
The circuit board apparatus (10) includes a first layer (12, 14), a second layer (12, 14) and an inner plate (19) disposed between the first layer (12, 14) and the second layer (12, 14). A fluid distributing conduit (38) is disposed in the inner plate (19). The fluid distributing conduit (38) has a first end (22), a central portion (24) defining a chamber, and a second end (26). A first electronic component (28) is disposed within the chamber (24). A nozzle (60) is disposed in the fluid distributing conduit (38). The nozzle (60) receives a fluid, atomizes the fluid and discharges the atomized fluid (70) into the chamber (24).

REFERENCES:
patent: 3648113 (1972-03-01), Rathjen et al.
patent: 4897762 (1990-01-01), Daikoku et al.
patent: 4912600 (1990-03-01), Jaeger et al.
patent: 4964019 (1990-10-01), Belanger, Jr.
patent: 5220804 (1993-06-01), Tilton et al.

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